FinFET Technology Market 2022 Analysis of Market Size & Future Growth Potential
According to MarketsandMarkets forecast, the FinFET Technology Market is expected to grow from USD 4.91 Billion in 2015 to USD 35.12 Billion by 2022, at a CAGR of 26.2% between 2016 and 2022. The miniaturization of semiconductor devices to continue the progression of Moore’s law, along with an increase in the performance of devices, is creating a huge demand for the adoption of FinFET technology across the world. Moreover, growing smartphones and consumer electronics market, and high performance with a lower current leakage than the bulk technology are also driving the growth of the market.
Key Target audience
- Wafer Manufacturers
- Raw Material and Manufacturing Equipment Suppliers
- Chip Manufacturers
- System Integrators
- Device Manufacturers
- Foundry Players
- Distributors and Retailers
- Research Organizations
- Technology Standard Organizations, Forums, Alliances, and Associations
- Technology Investors
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The scope of this report covers the FinFET technology market segmented on the basis of technology, product, end user, and region. On basis of technology, the 22nm process node segment is expected to hold the largest market share of the global FinFET technology market, and the 7nm FinFET process is expected be the fastest-growing technology to manufacture chips in various applications during the forecast period.
On the basis of products, the FinFET technology market is segmented into CPU, SoC, FPGA, GPU, MCU, and network processor. CPU segment led the market in 2015; however, the market for GPUs is expected to grow at the highest CAGR during the forecast period. Application processors in smartphones have the same functionalities as that of CPUs. Samsung (South Korea) led the market for application processors in 2015 by introducing its Exynos Octa 7 chips manufactured using the 14nm FinFET technology. In 2016, the next chip in the Exynos series (Exynos Octa 8) is expected to power the smartphones with more functionalities and improved performance.
Major players in this market are Intel (U.S.), Samsung (South Korea), GlobalFoundries (U.S.), and TSMC (Taiwan). These players have adopted various strategies such as partnerships, agreements, mergers & acquisitions, and new product developments to achieve growth in the global FinFET technology market.
The complexities in the FinFET design process restrain the growth of FinFET technology market. The major challenge for the adoption of FinFET technology is low costs of wafers and gate cost of FD-SOIs. The cost of processed wafer and gate in SOIs is lesser compared to bulk CMOS and FinFETs, and the considerations include processing and mask steps, tool depreciation, die shrink area, and parametric yield.
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